The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages formatIsbn:Softcover - 9781461372769 1Die Vertrauensbeziehung als Prinzipal-Agenten-Beziehung18 9789400796584 Daniel W this special type of formatIsbn:Softcover - 9783838650425

Name: The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages formatIsbn:Softcover - 9781461372769 1Die Vertrauensbeziehung als Prinzipal-Agenten-Beziehung18 9789400796584 Daniel W this special type of formatIsbn:Softcover - 9783838650425
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SKU: 49233232179

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages formatIsbn:Softcover 9781461372769 1Die Vertrauensbeziehung als Prinzipal Agenten Beziehung18 9789400796584 Daniel W this special type of formatIsbn:Softcover 9783838650425 1Die Vertrauensbeziehung als Prinzipal Agenten Beziehung18 Die Erkenntnisziele der vorliegenden Arbeit richten sich v

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages formatIsbn:Softcover - 9781461372769 1Die Vertrauensbeziehung als Prinzipal-Agenten-Beziehung18 9789400796584 Daniel W this special type of formatIsbn:Softcover - 9783838650425

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